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What are the characteristics of XPS extruded board

Views: 4     Author: Site Editor     Publish Time: 2020-08-18      Origin: Site

What are the characteristics of XPS extruded board?

XPS board is made of pure polystyrene resin continuously extruded and injected with catalyst foam, and its skin is very smooth and dense. Compared with the EPS board, the XPS board has a dense surface layer and a closed-cell structure inner layer. Its thermal conductivity is much lower than EPS of the same thickness, so it has better thermal insulation performance than EPS. For the same building exterior wall, its thickness can be smaller than other types of insulation materials. Due to the closed cell structure of the inner layer, it has good moisture resistance and can still maintain good thermal insulation performance in a humid environment; it is suitable for cold storage and other buildings with special requirements for thermal insulation, and can also be used for external walls Buildings where the facing material is brick or stone.

Although XPS board has good heat preservation and water resistance, it has higher strength and greater deformation stress, which makes the board more brittle and not easy to bend. When the stress on the board is concentrated, it is easy to cause cracks at the board seam; its surface is too smooth, so Adhesion to adhesives and surface glue is very poor, and the effect is not as good as EPS board. On the other hand, XPS board manufacturers have differences in production process control and raw material selection, resulting in different performance of XPS boards of various manufacturers The same also directly affects the actual application effect of the project.

Due to the above characteristics of XPS board, in actual engineering applications, if the material properties and construction methods cannot be strictly controlled, it is easy to cause the entire insulation layer to crack or fall off, which causes the entire system to have a particularly serious safety hazard. One of the key to solving the problem is to improve the bonding strength between the mortar and the XPS board, and to be able to destroy the XPS board itself.

Therefore, in order to improve the bonding performance between the mortar and the XPS board, the surface of the XPS board is mainly used for napping, embossing (which easily destroys the strength of the XPS surface), or applying an interface agent on the surface of the XPS board.

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